View MT0350-WR-A_3660591.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

specification part no. : MT0350-WR-A 3.2 x 2.8mm smd type observe precaution for handling electro static sensitive devices attention 3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com www.datasheet.co.kr datasheet pdf - http://www..net/
mt 0350-wr-a 3.2 x 2.8mm smd type ver.: 01 date : 2009/10/ 09 page: 1 / package dimensions 3.2 0.8 1.9 0.9 3.6 0.14 0.6 2.4 2.2 2.8 0.8 k a notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material em itting color lens color MT0350-WR-A ingan/sapphire w arm white water clear www.datasheet.co.kr datasheet pdf - http://www..net/
mt 0350-wr-a 3.2 x 2.8mm smd type ver.: 01 date : 2009/10/ 09 page: 2 / 6 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 120 mw reverse voltage v r 5 v d.c. forward current if 30 ma peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -40 to +100
storage temperature range tstg. -40 to +100
soldering temperature tsld. reflow soldering: 260
gpstfd hand soldering: 350
gpstfd electric static discharge threshold (hbm) esd 6000 v electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 370 mcd luminous flux v if=20ma 1950 mlm forward voltage vf if=20ma 3.2 4.0 v 29 - 31 - correlated colour temperature 33 cct if=20ma - o k reverse current ir vr=5v 50 a viewing angle 21/2 if=20ma 120 deg notes: 1.the datas tested by is tester. 2. customer?s special requirements are also welcome. www.datasheet.co.kr datasheet pdf - http://www..net/
ver.: 01 date : 2009/10/ 09 page: 3 / typical electrical/optical characteristic curves (25
ambient temperature unless otherwise noted) wavelength (nm) relative response 0 300 600 400 500 700 800 0.6 0.2 0.4 0.8 1.2 1.0 fig.1 white led spectrum vs. wavelength 3.02.52.0 10 3.5 40 20 30 50 4.0 4.5 forward voltage (v) forward current if(ma) 20 10 0 400 1200 800 50 30 40 1600 2000 forward current (ma) relative luminous intensity(mcd) forward current vs. applied voltage forward current vs. luminous intensity ambient temperature ta ( ) 0 204060 100 80 forward current if(ma) 10 20 40 30 50 80 90 60 70 50 30 40 0.1 0.5 0.7 0.8 0.3 1.0 0.9 0.4 0.2 0.6 0 10 20 ambient temperature vs. forward current radiation diagram mt 0350-wr-a 3.2 x 2.8mm smd type www.datasheet.co.kr datasheet pdf - http://www..net/
ver.: 01 date : 2009/10/ 09 page: 4 / precaution in use storage recommended storage environment temperature: 5 o c ~ 30 o c (41 o f ~ 86 o f) humidity: 60% rh max. use within 7 days after opening of sealed vapor/esd barrier bags. if the mois ture absorbent mater ial (s ilica ge l) has faded a way or the leds have exceeded the storage time, baking treatment should be performed us ing the following conditions. baking treatment : 60 ?5
for 24 hours. fold the opened bag firmly a nd keep in dry environment. soldering reflow so ldering hand soldering lead solder lead C free solder pre-heat 120~150
180~200
temperature 350
max . pre-heat time 120sec. max. 120sec. max. soldering time 3sec. max. peak temperature 240
max. 260
max . (one time only) soldering time 10sec. max. 10sec. max. condition refer to refer to t emperature- temperature- profile 1 profile 2 *after reflow soldering rapid cooling should be avoided. [temperature-profile (surface of circuit board)] use the conditions shown to the under figure. ? 1 : lead solder ? 2 : lead-free solder 120sec. max. 60sec. max. pre-heating 120~150 c 2.5~5 c/sec. 2.5~5 c/sec. 240 c max. 10sec. max. 120sec. max. 60sec. max. pre-heating 180~200c 1~5c/sec. 260 c max. 10sec. max. 1~5 c/sec. [ recommended soldering pad design ] use the following conditions shown in the figure. 2.2 1.8 1.4 1.4 (unit:mm) mt 0350-wr-a 3.2 x 2.8mm smd type www.datasheet.co.kr datasheet pdf - http://www..net/
ver.: 01 date : 2009/10/ 09 page: 5 / handling of silicone resin leds handling indications during processing, mechanical stress on the surf ace should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound figure 1 in general, leds should only be handled from th e side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. figure 2 when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanic al pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozz le which is larger than the leds reflector area. mt 0350-wr-a 3.2 x 2.8mm smd type www.datasheet.co.kr datasheet pdf - http://www..net/
ver.: 01 date : 2009/10/ 09 page: 6 / dimensions for tape 2.24 0.250.05 4.0 4.0 2.0 4.0 1.75 5.5 12.0 dimensions for reel 13.20.5 16.20.5 178.0 1 60.00.5 57 notes: 1.all dimensions are in mm, tolera nce is2.0mm unless otherwise noted. 2.specifications are subject to change without notice. mt 0350-wr-a 3.2 x 2.8mm smd type www.datasheet.co.kr datasheet pdf - http://www..net/

▲Up To Search▲

Price & Availability of MT0350-WR-A

	To Download MT0350-WR-A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .